Intel Arc Pro B70 32GB Specs, Benchmarks & Pricing

The Intel Arc Pro B70 is the flagship professional workstation GPU in Intel's Arc Pro B-series lineup, released on March 25, 2026 and built on the Xe2 (Battlemage) architecture using TSMC's 5nm process. Unlike its smaller siblings (B50 and B60) which use the BMG-G21 die, the Arc Pro B70 uses the larger BMG-G31 die with 32 Xe2 cores (compared to 20 cores in the B60), 256 XMX (Xe Matrix eXtension) engines for AI acceleration, and 32 ray tracing units. The GPU delivers 22.94 TFLOPS of FP32 compute performance and 367 peak TOPS of INT8 AI inference performance, paired with 32GB of GDDR6 memory on a 256-bit interface running at 19 Gbps for 608 GB/s of memory bandwidth. The 32GB memory capacity positions the Arc Pro B70 as a compelling option for large-model AI inference workloads, significantly exceeding competing professional cards in its price tier for VRAM density. The 256 XMX engines support a wide range of precision formats including INT2, INT4, INT8, FP16, BF16, and TF32, providing exceptional flexibility for AI inference tasks. With a TBP of 230W and an $949 MSRP, the Arc Pro B70 delivers outstanding value for AI workstation deployments, offering capabilities that traditionally cost far more in competing NVIDIA or AMD professional card lineups. The GPU supports PCIe 5.0 x16 interface and the Xe2 architecture provides full support for DirectX 12 Ultimate, Vulkan 1.3, OpenGL 4.6, and OpenCL 3.0, along with Intel oneAPI, OpenVINO, and the PyTorch IPEX extension for AI/ML frameworks. Display connectivity includes DisplayPort 2.1 outputs capable of driving displays at resolutions up to 7680x4320 (8K). Intel's Project Battlematrix multi-GPU configurations can leverage multiple Arc Pro B70 cards for even larger combined VRAM pools, with SR-IOV support for virtualization use cases. The card is certified for professional applications including Autodesk Maya, SolidWorks, Adobe Premiere Pro, Blender, and DaVinci Resolve.

Strengths

  • Excellent memory capacity (top 9% of GPUs)
  • Excellent INT8 inference performance (top 19% of GPUs)

Specifications for Intel Arc Pro B70

SpecificationPerformance Ranking
FP32 TFLOPs
47th @ 22.94 TFLOPs (Entry Tier)(Entry)
FP16 TFLOPs
35th @ 45.88 TFLOPs (Entry Tier)(Entry)
Tensor Core Count
67th @ 256 Cores (Mid Tier)(Mid)
Memory Capacity (GB)
91st @ 32 GB (Top Tier)(Top)
Memory Bandwidth (GB/s)
60th @ 608 GB/s (Mid Tier)(Mid)
Int8 TOPs
81st @ 367 TOPs (Top Tier)(Top)

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Price History

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Product Identifiers

Manufacturer Part Numbers (2)
Spec Code
SA4H2
Product Code
33P01IB0BB

References

Notes

  1. FP32 TFLOPS of 22.94 sourced from Intel official product specifications page (intel.com/content/www/us/en/products/sku/245797) and confirmed by ServeTheHome and Tom's Hardware reviews. This is consistent with 4096 shaders (32 Xe2 cores × 128 shaders/core) at 2800 MHz boost clock.
  2. FP16 TFLOPS of 45.88 represents 2× FP32 performance, consistent with Xe2 architecture XMX engine throughput for FP16 operations. This 2:1 FP16:FP32 ratio is consistent across all Arc Pro B-series products (B50 10.65/21.3, B60 12.28/24.58) and Intel Xe2 architecture documentation.
  3. INT8 TOPS of 367 represents dense (non-sparse) INT8 performance sourced from Intel official product specifications. Intel Arc Xe2 architecture does not use 2:4 structured sparsity, so published INT8 TOPS values are inherently dense. Dense value used for consistent cross-vendor comparison.
  4. Memory bandwidth of 608 GB/s calculated as 256-bit interface × 19 Gbps ÷ 8 bits/byte = 608 GB/s per Intel official specifications.
  5. TBP (Thermal Base Power) of 230W at reference design (2800 MHz boost) sourced from Intel official product specifications. Intel specifies a TBP range of 160W-290W for partner implementations. The Arc Pro B70 requires external PCIe power connectors.
  6. XMX (Xe Matrix eXtension) engine count of 256 sourced from Intel official specifications (32 Xe2 cores × 8 XMX engines per core = 256 total), consistent with the XMX engine counts of related B-series products (B50 = 16 cores × 8 = 128, B60 = 20 cores × 8 = 160).
  7. Xe2 architecture XMX engines support INT2, INT4, INT8, FP16, BF16, and TF32 precision formats on dedicated matrix multiplication hardware per Intel VTune Profiler documentation. TF32 is included in supportedHardwareOperations consistent with Intel Xe2 architecture capabilities.
  8. FP64 double precision is supported by the general-purpose Xe Vector Engines (XVEs) on the BMG-G31 die per Xe2 architecture documentation.
  9. The Arc Pro B70 uses the BMG-G31 die, a larger die than the BMG-G21 used in the Arc B580, Arc Pro B60, and Arc Pro B50. The BMG-G31 has 32 Xe2 cores enabling higher compute throughput and a 256-bit memory interface accommodating 32GB of GDDR6 memory.
  10. MSRP of $949 USD sourced from Intel Newsroom launch announcement and corroborated by Tom's Hardware, HotHardware, and Phoronix reviews at launch. Intel positioned the Arc Pro B70 at $949 to compete with NVIDIA and AMD professional workstation GPUs while offering substantially more VRAM (32GB) at that price point.
  11. Release date of 2026-03-25 sourced from HotHardware, ServeTheHome, and Tom's Hardware launch coverage. The B70 launched alongside the B65 announcement on March 25, 2026.
  12. Intel Spec Code SA4H2 and ordering code 33P01IB0BB sourced from Intel official ordering page. The value 245797 in the product page URL is the Intel product SKU, not the Spec Code.
  13. No thirdPartyProducts are included because specific AIB partner model numbers and part numbers for Arc Pro B70 products could not be verified from official manufacturer product pages at time of research. AIB partners in the Arc Pro B-series ecosystem include ASRock, Sparkle, Gunnir, and Maxsun, but specific B70 product identifiers require verification against manufacturer websites.